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"LCA to go" approach discussed at EIPC Winter Conference Berlin 2013

"LCA to go" approach discussed at EIPC Winter Conference Berlin 2013

The European Institute of Printed Circuits (EIPC) invites engineers, PCB fabricators, decision-makers and specialists to participate in the conference from the 31st of January to the 1st of February 2013 in Berlin, Germany.

The conference's main topic is future innovation of interconnection and packaging in the field of PCB as well as international market conditions. There will be much novelty, with presentations on some new technologies such a new surface finish from Atotech Deutschland GmbH, a new ultra-flat copper foil for low-loss PCBs, new capacitive systems and a new soldering finish for RF performance. Day 2 of the conference brings some interesting case studies on black pad failure, crack propagation, the reliability of electroless copper, and accelerated mechanical testing, and a look at circuit boards for LED, embedded RFID technology, and embedded modules for high power applications. Karsten Schischke from the Fraunhofer IZM, in cooperation with ITR and ELDOS, will give the LCA to go presentation Environmental Assessment of Printed Circuit Board Production to Support Design Decisions and Facilitate Carbon Footprinting of Electronics Products in order to raise awareness for ecological innovations.

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from Karsten Schischke at